Negotiable
The date of payment from buyers deliver within days
Guangdong
Long-term effective
2017-07-19 05:57
126
Company Profile
Shenzhen Rigao Electronics Co., Ltd.By certification [File Integrity]
Contact:Mr. Alex Su(Mr.)
Email:
Telephone:
Phone:
Area:Guangdong
Address:Guangdong
Website: http://rigao-pcba.hrdwiremesh.com/
Rigid PCB Capability | |||
No. | Item | Capability | |
1 | Layer Count | 1-30Layers | |
2 | HDI Type | 1+N+1, 2+N+2 | |
3 | Material | CEM3, FR-4, Halogen Free, Aluminum-based, Teflon,Rogers, etc | |
4 | Board thickness | 0.2~5.0mm | |
5 | Board Size | Max | 600*1000mm (24"x40") |
Min | 30x50mm | ||
6 | Copper Thickness | Outer layer | 1oz~6oz |
Inner layer | 0.5oz~5oz | ||
7 | Min. Line Width/Space | 4/4mil(0.1/0.1mm) | |
8 | Finished Hole size | Mechanical | 0.20~6.30mm |
Laser | 5mil, 6mil | ||
9 | Blind/buried via(Mechanical) | 0.2mm (min) | |
10 | Aspect Ratio | 10:1 | |
11 | Hole Dia.Tolerance | PTH | ±0.075mm(3mil) |
NPTH | ±0.05mm (2mil) | ||
12 | Hole Position Tolerance | ±0.05mm (2mil) | |
13 | Bow & Twist | ≤0.75% | |
14 | Peel strength | 1.4N/mm | |
15 | Thermal stress | 288 degrees centigrade & 20 Sec | |
16 | Test Voltage | 50-300V | |
17 | Soldermask color | Green, Red, Blue, Black, White,Yellow | |
18 | Outline Tolerance | ±0.10mm (4mil) | |
19 | Surface Finish | HASL, Lead free HASL, Immersion Gold/Tin/Silver, OSP, Flash Gold, Gold fingers, Plating Hard Gold, Carbon lnk, Peelable mask |
Type of PCB Assembly | SMT, Thru-hole,COB |
SMT | Position accuracy:20 um |
Components size:0.4×0.2mm(01005) _130×79mm,Flip-CHIP,QFP,BGA,POP | |
Max. component height::25mm | |
Max. PCB size:680×500mm | |
Min. PCB size:no limited | |
PCB thickness:0.3 to 7mm | |
Wave Solder | Max. PCB width:450mm |
Min. PCB width: no limited | |
Component height:Top 120mm/Bot 15mm | |
Sweat-Solder | Metal type :part, whole, inlay, sidestep |
Metal material:Copper , Aluminum | |
Surface Finish:plating Au, plating sliver , plating Sn | |
Air bladder rate:less than20% | |
Supporting: | Software burning and Function Testing |
Testing | X-RAY Inspection & AOI Test, ICT,Probe flying,burn-in,function test,temperature cycling |
Lead Time | 12days-15days |
File Fomat | Bill of Materials,Gerber Files, Pick-N-Place File (XYRS),PCB,Altium, EDA etc |